A low-temperature thin-film electroplated metal vacuum package

Journal of Microelectromechanical Systems

Volumn 13, Issue 2, 2004, Pages 147-157

  Stark, Brian H ^a,b   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b The Department of Civil and Environmental Engineering   (United States)

Author keywords

Electroplating; Thin film package; Vacuum packaging

Indexed keywords

ELECTRONICS PACKAGING; ELECTROPLATING; LOW TEMPERATURE OPERATIONS; METALLIC FILMS; NICKEL; PHOTORESISTS; SEALING (FINISHING); THIN FILMS; VACUUM APPLICATIONS;

ELECTROPLATED METAL VACUUM PACKAGE; FABRICATION TEMPERATURE; HERMETICITY; PACKAGE SEALING;

MICROELECTROMECHANICAL DEVICES;

EID: 1942436715     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.825301     Document Type: Article

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