A low-temperature thin-film electroplated metal vacuum package

Journal of Microelectromechanical Systems

Volumn 13, Issue 2, 2004, Pages 147-157

  Stark, Brian H ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Electroplating; Thin film package; Vacuum packaging

Indexed keywords

ELECTRONICS PACKAGING; ELECTROPLATING; LOW TEMPERATURE OPERATIONS; METALLIC FILMS; NICKEL; PHOTORESISTS; SEALING (FINISHING); THIN FILMS; VACUUM APPLICATIONS;

ELECTROPLATED METAL VACUUM PACKAGE; FABRICATION TEMPERATURE; HERMETICITY; PACKAGE SEALING;

MICROELECTROMECHANICAL DEVICES;

EID: 1942436715     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.825301     Document Type: Article

References (54)

1. D. Galayko, A. Kaiser, B. Legrand, D. Collard, L. Buchaillot, and C. Combi, "High-frequency high-Q micro-mechanical resonators in thick epipoly technology with post-process gap adjustment," in Proc. 15th IEEE International Conference on Microelectromechanical Systems, Las Vegas, NV, 2002, pp. 665-668.
2. W.-T. Hsu, J. R. Clark, and C. T.-C. Nguyen, "Mechanically temperature-compensated flexural-mode micromechanical resonators," in Proc. International Electron Devices Meeting, San Francisco, CA, 2000, pp. 399-402.
3. D. S. Y. Hsu, J. Wang, J. E. Butler, and C. T.-C. Nguyen, "CVD polycrystalline diamond high-Q micromechanical resonators," in Proc. 15th IEEE International Conference on Microelectromechanical Systems, Las Vegas, NV, 2002, pp. 657-660.
4. W.-T. Hsu and C. T.-C. Nguyen, "Stiffness-compensated temperature insensitive micromechanical resonators," in Proc. 15th IEEE International Conference on Microelectromechanical Systems, Las Vegas, NV, 2002, pp. 731-734.
5. K. Wang, Y. Yu, A.-C. Wong, and C. T.-C. Nguyen, "VHF free-free beam high-Q micromechanical resonators," in Proc. 12th IEEE International Conference on Microelectromechanical Systems, Orlando, FL, 1999, pp. 453-458.
6. C. T.-C. Nguyen, L. P. B. Katehi, and G. M. Rebeiz, "Micromachined devices for wireless communications," Proc. IEEE, vol. 86, pp. 1756-1768, 1998.
7. M. Abe, E. Shinohara, K. Hasegawa, S. Murata, and M. Esashi, "Trident-type tuning fork silicon gyroscope by the phase difference detection," in Proc. 13th IEEE International Conference on Microelectromechanical Systems, Miyazaki, Japan, 2000, pp. 508-513.
8. F. Ayazi and K. Najafi, "A HARPSS polysilicon vibrating ring gyroscope," J. Microelectromech. Syst., vol. 10, pp. 169-179, 2001.
9. B.-L. Lee, S.-W. Lee, K.-D. Jung, J.-H. Choi, T.-R. Chung, and Y.-C. Cho, "A de-coupled vibratory gyroscope using a mixed micro-machined technology," in Proc. IEEE International Conference on Robotics and Automation, Seoul, South Korea, 2001, pp. 3412-3416.
10. H. Song, Y. S. Oh, I. S. Song, S. J. Kang, S. O. Choi, H. C. Kim, B. J. Ha, S. S. Baek, and C. M. Song, "Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabricated process," in Proc. 13th IEEE International Conference on Microelectromechanical Systems, Miyazaki, Japan, 2000, pp. 520-524.
11. N. Yazdi, F. Ayazi, and K. Najafi, "Micromachine inertial sensors," Proc. IEEE, vol. 86, pp. 1640-1658, 1998.
12. B.-L. Lee, C.-H. Oh, S. Lee, Y.-S. Oh, and K.-J. Chun, "Vacuum packaged differential resonant accelerometer using gap sensitive electrostatic stiffness changing effect," in Proc. 13th IEEE International Conference on Microelectromechanical Systems, Miyazaki, Japan, 2000, pp. 352-357.
13. M. Mottonen and A. Oja, "Micromechanical DC-DC converter," in Proc. SPIE: The International Society for Optical Engineering, vol. 4408, 2001, pp. 59-62.
14. V. Milanovic, L. Doherty, D. A. Teasdale, S. Parsa, and K. S. J. Pister, "Micromachining technology for lateral field emission devices," IEEE Trans. Electron Devices, vol. 48, pp. 166-173, 2001.
15. G. H. He, L. Lin, and Y. T. Cheng, "Localized CVD bonding for MEMS packaging," in Proc. 10th International Conference on Solid-State Sensors and Actuators (Transducers '99), Sendai, Japan, p. 1999.
16. N. K. Budraa, H. W. Jackson, M. Barmatz, W. T. Pike, and J. D. Mai, "Low pressure and low temperature hermetic wafer bonding using microwave heating," in Proc. 12th IEEE International Conference on Microelectromechanical Systems, Orlando, FL, 1999, pp. 490-492.
17. Y. T. Cheng, W. T. Hsu, L. Lin, C. T. Nguyen, and K. Najafi, "Vacuum packaging technology using localized aluminum/silicon-to-glasss bonding," in Proc. 14th IEEE International Conference on Microelectromechanical Systems (MEMS), Interlaken, Switzerland, p. 2001.
18. M. Chiao and L. Lin, "Hermetic wafer bonding based on rapid thermal processing," Sens. Actuators, Phys. A, vol. 91, pp. 398-402, 2001.
19. W. H. Ko, J. T. Sumito, and G. J. Yeh, "Bonding techniques for microsensors," in Micromachining and Micropackaging of Transducers. New York: Elsevier, 1985, p. 41.
20. L. Lin, "MEMS post-packaging by localized heatine and bonding," IEEE Trans. Adv. Packag., vol. 23, pp. 605-616, 2000.
21. D.-J. Lee, B.-K. Ju, Y.-H. Lee, J. Jang, and M.-H. Oh, "Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability," in Proc. 13th IEEE International Conference on Microelectromechanical Systems, Miyazaki, Japan, 2000, pp. 253-258.
22. A. Singh, D. A. Horsley, M. B. Cohn, A. P. Pisano, and R. T. Howe, "Batch transfer of microstructures using flip-chip solder bonding," J. Microelectromech. Syst., vol. 8, pp. 27-33, 1999.
23. K. E. Peterson and P. Barth, "Silicon fusion bonding for pressure sensors," in Proc. 1988 Solid-State Sensor and Actuator Workshop, Hilton Head, SC, 1988, pp. 144-147.
24. Y. Mei, G. R. Laniji, and K. Najafi, "A robust gold-silicon eutectic wafer bonding technology for vacuum packaging," in Proc. Solid-State Sensors and Actuators Workshop,l Hilton Head, SC, p. 2002.
25. R. Aigner, K.-G. Opperman, H. Kapels, and S. Kolb, ""Cavity micromachining" technology: zero package solution for inertial sensors," in Proc. 11th International Conference on Solid-State Sensors and Actuators (Transducers '01), Munich, Germany, 2001, pp. 186-189.
26. B. H. Stark and K. Najafi, "An ultra-thin hermetic package utilizing electroplated gold," in Proc. 11th International Conference on Solid-State Sensors and Actuators (Transducers '01), Munich, Germany, 2001, pp. 197-197.
27. M. Bartek, J. A. Foerster, and R. F. Wolffenbuttel, "Vacuum sealing of microcavities using metal evaporation," Sens. Actuators, Phys. A, vol. 61, pp. 364-368, 1997.
28. K. Ikeda, H. Kuwayama, T. Kobayashi, T. Watanabe, T. Nishikawa, T. Yoshida, and K. Harada, "Three-dimensional micromachining of silicon pressure sensor integrating resonant strain gauge on diaphragm," Sens. Actuators, Phys. A, vol. 23, pp. 1007-1010, 1990.
29. L. Lin, R. T. Howe, and A. P. Pisano, "Microelectromechanical filters for signal processing," J. Microelectromech. Syst., vol. 7, pp. 286-294, 1998.
30. C. H. Mastrangelo, "Vacuum-sealed silicon micromachined incandescent light source," in Proc. International Electron Devices Meeting, p. 1989.
31. W.-T. Park, R. N. Candler, S. Kronmueller, M. Lutz, A. Partridge, G. Yama, and T. Kenny, "Wafer-scale film encapsulation of micromachined accelerometers," in Proc. 12th International Conference on Solid-State Sensors and Actuators (Transducers '03), Boston, MA, 2003, pp. 1903-1906.
32. T. Tsuchiya, Y. Kageyama, H. Funabashi, and J. Sakata, "Polysilicon vibrating gyroscope vacuum-encapsulated on-chip micro chamber," Sens. Actuators, Phys. A, vol. 90, pp. 1-2, 2001.
33. L. Lin, C. T. Nguyen, R. T. Howe, and A. P. Pisano, "Microelectromechanical filters for signal processing," in Proc. 5th IEEE International Conference on Microelectromechanical Systems, Travemunde, Germany, 1992, pp. 226-231.
34. W.-F. Huang, J.-S. Shie, C. Lee, S. C. Gong, and C.-J. Peng, "Development of low-temperature wafer level vacuum packaging for microsensors," in Proc. SPIE: The International Society for Optical Engineering, vol. 3893, 1999, pp. 478-485.
35. D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi, and K. Jayakar, "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder," J. Micromechan. Microeng., vol. 11, pp. 630-634, 2001.
36. F. Niklaus, P. Enoksson, E. Kalvesten, and G. Stemme, "Low-temperature full wafer adhesive bonding," J. Micromechan. Microeng., vol. 11, pp. 100-107, 2001.
37. K. F. Lei, W. J. Li, N. Budraa, and J. D. Mai, "Microwave bonding of polymer-based substrates for micro/nano fluidic applications," Proc. 12th International Conference on Solid-State Sensors and Actuators and Actuators (Transducers '03), Boston, MA, 2003, pp. 1335-1338.
38. P. Chang-Chien and K. D. Wise, "Wafer-level packaging by localized mass deposition," in Proc. 11th International Conference on Solid-State Sensors and Actuators (Tranducers '01), Munich, Germany, 2001, pp. 182-185.
39. J. Kim, M. Chiao, and L. Lin, "Ultrasonic bonding of In/Au and Al/Al for hermetic sealing of MEMS packaging," in Proc. 15th IEEE International Conference on Microelectromechanical Systems, Las Vegas, NV, 2002, pp. 415-418.
40. "Sealed Cavity Semiconductor Pressure Transducers and Method of Producing the Same," U.S. Patent 4 853 669.
41. C. H. Mastrangelo, R. S. Muller, and S. Kumar, "Microfabricated incandescent lamps," Appl. Opt., vol. 30, pp. 868-873, 1993.
42. J. Smith, S. Montague, J. Sniegowski, R. Manginell, P. McWhorter, and R. Huber, "Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS," in Proc. SPIE The International Society for Optical Engineering, vol. 2879, 1996, pp. 306-314.
43. J. L. Lund, C. V. Jahnes, H. Deligianni, L. P. Buchwalter, J. M. Cotte, P. Andricacos, D. E. Seeger, and J. H. Magerlein, "A low temperature Bi-CMOS compatible process for MEMS RF resonators and filters," in Proc. 2002 Solid-State Sensor and Actuator Workshop, Hilton, Head, SC, 2002, pp. 38-41.
44. D. Maier-Schneider, J. Maibach, and E. Obermeier, "New analytical solution for the load-deflection of square membranes," J. Microelectromech. Syst., vol. 4, pp. 238-241, 1995.
45. K. E. Crowe and R. L. Smith, "New technique for determination of tensile stress in thin films," J. Electrochem. Soc., vol. 136, pp. 1566-1568, 1989.
46. R. A. Stewart, J. Kim, E. S. Kim, R. M. White, and R. S. Muller, "Young's modulus and residual stress of LPCVD silicon-rich silicon nitride determined from membrane deflection," Sens. Materials, vol. 2, pp. 285-298, 1991.
47. L. S. Stephens, K. W. Kelly, S. Simhadri, A. B. McCandless, and E. I. Meletis, "Mechanical property evaluation and failure analysis of cantilevered LIGA nickel microposts," J. Microelectromech. Syst., vol. 10, 2001.
48. Y. T. Cheng, "Localized Heating and Bonding Technique for MEMS Packaging," Ph.D. Thesis, Electrical Engineering and Computer Science at The University of Michigan, Ann Arbor, MI, 2000.
49. B. H. Stark, Y. Mei, C. Zhang, and K. Najafi, "A doubly anchored surface micromachined pirani gauge for vacuum package characterization," in Proc. 16th IEEE International Conference on Microelectromechanical Systems (MEMS), Kyoto, Japan, 2003, pp. 506-509.
50. B. H. Stark and K. Najafi, "A wafer-level vacuum packaging technology utilizing electroplated nickel," in Proc. ASME IMECE, New Orleans, LA, 2002, pp. 454-459.
51. B. H. Stark, Y. Mei, C. Zhang, and K. Najafi, "A doubly-anchored surface micromachined pirani gauge for vacuum monitoring," J. Microelectromech. Syst., 2003, submitted for publication.
52. A. DeHennis and K. D. Wise, "An all-capacitive sensing chip for temperature, absolute pressure, and relative humidity," in Proc. 12th International Conference on Solid-State Sensors and Actuators (Transducers '03), Boston, MA, 2003, pp. 1860-1863.
53. B. H. Stark and K. Najafi, "An integrated process for post-packaging relese and vacuum sealing of electroplated nickel packages," in Proc. 12th International Conference on Solid-State Sensors and Actuators (Transducers '03), Boston, MA, 2003, pp. 1911-1914.
54. T. C. Hodge, S. A. Bidstrup-Allen, and P. A. Kohl, "Stresses in thin film metallization," IEEE Trans. Compon., Packag., Manufact. Technol. Part A, vol. 20, pp. 241-250, 1997.