Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 253-258

  Lee, Duck Jung ^a   Ju, Byeong Kwon ^a   Lee, Yun Hi ^a   Jang, Jin ^a   Oh, Myung Hwan ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS FILMS; AMORPHOUS SILICON; BONDING; CHEMICAL BONDS; COMPOSITION EFFECTS; DISPLAY DEVICES; ELECTRON EMISSION; ELECTRONICS PACKAGING; SECONDARY ION MASS SPECTROMETRY; THIN FILMS; VACUUM APPLICATIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

ANODIC BONDING; FIELD EMISSION DISPLAY (FED) PANELS; SPINNING ROTOR GAUGES (SRG); VACUUM SEALING;

MICROELECTRONICS;

EID: 0033724552     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (18)