Wafer-scale film encapsulation of micromachined accelerometers

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1903-1906

  Park, W T ^a   Candler, R N ^a   Kronmueller, S ^b   Lutz, M ^b   Partridge, A ^b   Yama, G ^b   Kenny, T W ^a  

^a STANFORD UNIVERSITY   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

Author keywords

Accelerometers; Commercialization; Costs; Encapsulation; Glass; Microelectromechanical devices; Packaging; Silicon; Thick films; Wafer bonding

Indexed keywords

ACCELEROMETERS; ACTUATORS; BONDING; COST REDUCTION; COSTS; ELECTRONICS PACKAGING; ENCAPSULATION; EPITAXIAL GROWTH; GLASS; GLASS BONDING; INJECTION MOLDING; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; PACKAGING; SILICON; SILICON WAFERS; SOLID-STATE SENSORS; THICK FILMS; TRANSDUCERS;

ADVANCED PACKAGING; CAPACITIVE ACCELEROMETERS; COMMERCIALIZATION; FILM ENCAPSULATION; MICROMACHINED ACCELEROMETERS; PACKAGING PROCESS; PIEZO-RESISTIVE; POST PROCESSING;

WAFER BONDING;

EID: 84944726727     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217163     Document Type: Conference Paper

References (7)

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