Hermetic wafer bonding based on rapid thermal processing

Sensors and Actuators, A: Physical

Volumn 91, Issue 3, 2001, Pages 398-402

  Chiao, Mu ^a   Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Hermetic wafer bonding; MEMS packaging; Rapid thermal processing

Indexed keywords

ALUMINUM; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; RAPID THERMAL ANNEALING; SEMICONDUCTING GLASS; SEMICONDUCTING SILICON; SUBSTRATES; ENCAPSULATION; SILICON WAFERS; SOLDERING ALLOYS;

HERMETIC WAFER BONDING; RAPID THERMAL PROCESSING;

INTEGRATED CIRCUIT MANUFACTURE; ELECTRONICS PACKAGING;

EID: 0035880220     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00613-6     Document Type: Article

References (11)

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