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Volumn 2879, Issue , 1996, Pages 306-314
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Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS
a a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
MICROMECHANICAL DEVICES;
POLYSILICON;
ANNEALING;
CHARACTERIZATION;
CMOS INTEGRATED CIRCUITS;
ELECTRONICS PACKAGING;
MANUFACTURE;
MONOLITHIC INTEGRATED CIRCUITS;
SEMICONDUCTING SILICON;
SIGNAL PROCESSING;
MICROELECTROMECHANICAL DEVICES;
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EID: 0030420697
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (22)
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References (13)
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