Stresses in thin film metallization

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 2, 1997, Pages 241-249

  Hodge, Thomas C ^a   Bidstrup Allen, Sue Ann ^b   Kohl, Paul A ^b  

^a Michelin Americas Research and Development Corporation   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Aluminum; Coefficient of thermal expansion; Gold; Modulus; Silver; Stress; Temperature

Indexed keywords

ALUMINUM; GOLD; HEAT TRANSFER COEFFICIENTS; METALLIZING; RELIABILITY; SILVER; THERMAL EXPANSION; THERMAL STRESS;

COEFFICIENT OF THERMAL EXPANSION (CTE);

THIN FILMS;

EID: 0031162348     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.588580     Document Type: Article

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