Development of low-temperature wafer level vacuum packaging for microsensors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3893, Issue , 1999, Pages 478-485

  Huang, Wei Feng ^a   Shie, Jin Shown ^a   Lee, Chengkuo ^a   Gong, Shih Chin ^a   Peng, Cheng Jien ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MICROSENSORS; SILICON WAFERS; SOLDERING; VACUUM APPLICATIONS;

LOW-TEMPERATURE WAFER LEVEL VACUUM PACKAGING;

MICROELECTRONICS;

EID: 0033309965     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)