Microelectromechanical filters for signal processing

Journal of Microelectromechanical Systems

Volumn 7, Issue 3, 1998, Pages 286-294

  Lin, Liwei ^b,e,f,g,h   Howe, Roger T ^{a,c,f,i,j,k,l,m}   Pisano, Albert P ^d,f,n,o,p,q  

^a IEEE

^b UNIVERSITY OF MICHIGAN   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^f UNIVERSITY OF CALIFORNIA   (United States)

^g BEI Electronics Inc   (United States)

^h NATIONAL TAIWAN UNIVERSITY   (Taiwan)

ⁱ HARVEY MUDD COLLEGE   (United States)

^j CARNEGIE MELLON UNIVERSITY   (United States)

^k MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^l Electrical Engineering Co   (Romania)

^m Solid State Sensor Actuator Workshop   (United States)

ⁿ IEEE Micro Electro Mech Sys W ^*  (United States)

^o Solid State Sensor Actuator Workshop ^*

^p Research Staff   (United States)

^q GENERAL MOTORS CORPORATION   (United States)

more..

Author keywords

Coupling springs; Microelectromechanical filters; Resonators; Vacuum encapsulation

Indexed keywords

BANDWIDTH; ENCAPSULATION; FREQUENCY MODULATION; HERMETIC SEALS; MICROELECTROMECHANICAL DEVICES; RESONATORS; SIGNAL PROCESSING; SIGNAL TO NOISE RATIO; SILICON WAFERS; VACUUM APPLICATIONS;

COUPLING SPRINGS; MICROELECTROMECHANICAL FILTERS; MICRORESONATORS; VACUUM ENCAPSULATION;

ELECTRIC FILTERS;

EID: 0032164259     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.709645     Document Type: Article

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