Au-Sn bonding material for the assembly of power integrated circuit module

Journal of Alloys and Compounds

Volumn 671, Issue , 2016, Pages 340-345

  Zhu, Z X ^a   Li, C C ^a   Liao, L L ^b   Liu, C K ^b   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Diffusion; Intermetallics; Kinetics; Microstructure; Solid state reactions; Surfaces and interfaces

Indexed keywords

DIFFUSION; ENZYME KINETICS; EUTECTICS; GROWTH KINETICS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); INTERFACE STATES; INTERMETALLICS; MICROSTRUCTURE; PHASE INTERFACES; POWER INTEGRATED CIRCUITS; RECONFIGURABLE HARDWARE; SOLDERING ALLOYS; SOLID STATE REACTIONS; SURFACE REACTIONS;

ALTERNATING CURRENT; BONDING MATERIALS; COPPER SUBSTRATES; HIGH TEMPERATURE POWER ELECTRONICS; INTEGRATED CIRCUIT MODULE; ISOTHERMAL AGING; MICRO-STRUCTURE EVOLUTIONS; SURFACES AND INTERFACES;

TIN;

EID: 84959296179     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2016.02.065     Document Type: Article

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