Thermodynamic reassessment of Au-Ni-Sn ternary system

Calphad: Computer Coupling of Phase Diagrams and Thermochemistry

Volumn 43, Issue , 2013, Pages 61-70

  Dong, H Q ^a   Vuorinen, V ^a   Laurila, T ^a   Paulasto Krockel M ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Au Ni Sn; Diffusion couples; Diffusion path; Thermodynamic modeling

Indexed keywords

AU-NI-SN; DIFFUSION COUPLE; DIFFUSION PATHS; FORMATION AND EVOLUTIONS; ISOTHERMAL SECTIONS; THERMODYNAMIC MODEL; THERMODYNAMIC PARAMETER; THERMODYNAMIC REASSESSMENT;

MICROSTRUCTURE; NICKEL; TERNARY SYSTEMS; THERMODYNAMICS;

TIN;

EID: 84888344035     PISSN: 03645916     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.calphad.2013.10.001     Document Type: Article

References (25)

1. S. Farrens, Technical Publications, SÙSS Micro. Tec. Inc. Semicon Japan, 2008.
2. M. Esashi J. Micromech. Microeng. 18 2008 073001
3. W.D. Macdonald, and T.W. Eagar Annu. Rev. Mater. Sci. 22 1992 23 46
4. W.C. Welch, K. Najafi, Micro-electro mechanical systems, in: IEEE Proceedings of the 21st International Conference on MEMS (MEMS 2008), 2008, pp. 806-809.
5. T.A. Toliefsen, A. Larsson, O.M. Løvvik, and K. Aasmundtveit Metall. Mater. Trans. B 43 2012 397 405
6. H.G. Song, J.P. Ahn, and J.W. Morris Jr. J. Electron. Mater. 30 2001 1083 1087
7. J.-W. Yoon, H.-S. Chun, and S.-B. Jung Mater. Res. Soc. 22 2007 1219 1229
8. J.W. Morris Jr., and H.L. Reynolds Adv. Electron. Packag. 19-20 1997 1529 1534
9. T. Laurila, V. Vuorinen, and J.K. Kivilahti. Mater. Sci. Eng. R: Rep. 49 2005 1 60
10. T. Laurila, V. Vuorinen, and M. Paulasto-Kröckel Mater. Sci. Eng. R: Rep. 68 2010 1
11. J.H. Wang, X.-G. Lu, B. Sundman, and X.P. Su Calphad 29 2005 263
12. P.Y. Chevalier Thermochim. Acta 130 1988 1
13. H.S. Liu, C.L. Liu, K. Ishida, and Z.P. Jin J. Electron. Mater. 23 2003 1290
14. V. Grolier, and R. Schmid-Fetzer J. Mater. Res. 98 2007 797
15. H.Q. Dong, S. Jin, L.G. Zhang, J.S. Wang, X.M. Tao, H.S. Liu, and Z.P. Jin J. Electron. Mater. 38 2009 2158
16. A. Dȩbski, W. Ga̧sior, Z. Moser, and R. Major J. Alloys Compd. 491 2010 173
17. H.Q. Dong, X.M. Tao, T. Laurila, V. Vuorinen, and M. Paulasto- Kröckel Calphad 42 2013 38
18. A. Zemanova, A. Kroupa, and A. Dinsdale Monatsh. Chem. Chem. Mon. 143 2012 1255
19. C. Schmetterer, H. Flandorfer, K.W. Richter, U. Saeed, M. Kauffman, P. Roussel, and H. Ipser Intermetallics 15 2007 869
20. A. Neumann, A. Kjekshus, and E. Røst J. Solid State Chem. 123 1996 203
21. S. Anhöck, H. Oppermann, C. Kallmayer, R. Aschenbrenner, L. Thomas, H. Reichl, Proceedings of the Twenty-Second IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT-Europe), 1998, pp. 156.
22. X.J. Liu, M. Kinaka, Y. Takaku, I. Ohnuma, R. Kainuma, and K. Ishida J. Electron. Mater. 34 2005 670
23. F. Korber, and W. Oelsen Mitt. Kaiser-Wilhelm Inst. Eisenforsch. Düsseldorf 19 1937 209
24. B. Predel, and W. Vogelbein Thermochim. Acta 30 1979 205
25. J.S. Kirkaldy, and L.C. Brown Can. Metall. Q. 2 1963 89