Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations

Journal of Electronic Materials

Volumn 44, Issue 11, 2015, Pages 4576-4588

  Lis, Adrian ^a   Leinenbach, Christian ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

annealing; defect formation; microstructure; shear strength; TLP bonding

Indexed keywords

ANNEALING; BRITTLE FRACTURE; COMPOSITE FILMS; DEFECTS; DUCTILE FRACTURE; GRAIN BOUNDARIES; INTERMETALLICS; MICROSTRUCTURE; NICKEL; SHEAR STRENGTH; SILVER; SOLDERING ALLOYS; STRESSES; SUBSTRATES; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSIONS; DEFECT FORMATION; GROWTH CHARACTERISTIC; ISOTHERMAL SOLIDIFICATION; LONG-TERM ANNEALING; PROCESS TEMPERATURE; TLP BONDING; TRANSIENT LIQUID PHASE BONDING;

TIN;

EID: 84942825955     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-015-3982-3     Document Type: Article

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