Low temperature transient liquid phase bonding of Au/Sn and Cu/Sn electroplated material systems for MEMS wafer-level packaging

Microsystem Technologies

Volumn 19, Issue 8, 2013, Pages 1119-1130

  Marauska, S ^a   Claus, M ^a   Lisec, T ^a   Wagner, B ^a  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TEMPERATURES; CROSS-SECTION ANALYSIS; ELECTROPLATED MATERIALS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; LATERAL DIMENSION; LOW TEMPERATURES; MECHANICAL SYSTEMS; WAFER LEVEL PACKAGING;

MATERIALS SCIENCE; MEMS; QUALITY CONTROL; TEMPERATURE; WAFER BONDING; X RAY SPECTROSCOPY;

ELECTRONICS PACKAGING;

EID: 84880851172     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-012-1708-5     Document Type: Article

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