Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 45, Issue 5, 2014, Pages 2343-2346

  Li, C C ^a   Chung, C K ^a,b   Shih, W L ^a   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Intel Microelectronics Asia Taiwan   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

SHRINKAGE; SOLID STATE REACTIONS;

HEIGHT REDUCTION; INTEGRATED CIRCUIT APPLICATIONS; MICRO-JOINT; SOLID-STATE REACTIONS; SURFACE PROFILOMETERS; VOIDS FORMATION; VOLUME SHRINKAGE;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84898776238     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-014-2263-8     Document Type: Article

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