Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn

Materials Letters

Volumn 156, Issue , 2015, Pages 150-152

  Li, C C ^a   Ke, J H ^a   Yang, C A ^a   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Electrodeposition; Electronic materials; Interfaces; Intermetallic alloys and compounds; Microstructure

Indexed keywords

ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLID STATE REACTIONS; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIN;

AG DOPED; ELECTRONIC MATERIALS; HEIGHT REDUCTION; INTERMETALLIC ALLOYS AND COMPOUNDS; MICRO-JOINT; SHARP CONTRAST; VOID FORMATION; VOLUME SHRINKAGE;

SHRINKAGE;

EID: 84929990841     PISSN: 0167577X     EISSN: 18734979     Source Type: Journal    
DOI: 10.1016/j.matlet.2015.05.016     Document Type: Article

References (12)

1. H.Y. Chuang, T.L. Yang, M.S. Kuo, Y.J. Chen, J.J. Yu, C.C. Li, and C.R. Kao Critical concerns in soldering reactions arising from space confinement in 3-D IC packages IEEE Trans Device Mater Rel 12 2012 233 240
2. C.C. Li, C.K. Chung, W.L. Shih, and C.R. Kao Volume shrinkage induced by interfacial reaction in micro-Ni/Sn/Ni joints Metall Mater Trans A 45 2014 2343 2346
3. K. Kulojärvi, V. Vuorinen, and J. Kivilahti Effect of dissolution and intermetallic formation on the reliability of FC joints Microelectron Int 15 1998 20 24
4. H.Y. Chuang, J.J. Yu, M.S. Kuo, H.M. Tong, and C.R. Kao Elimination of voids in reactions between Ni and Sn: a novel effect of silver Scripta Mater 66 2012 171 174
5. J.J. Yu, C.A. Yang, Y.F. Lin, C.H. Hsueh, and C.R. Kao Optimal Ag addition for the elimination of voids in Ni/SnAg/Ni micro joints for 3D IC applications J Alloy Compd 629 2015 16 21
6. G.F.V. Voort ASM Handbook: Volume 9: Metallography And Microstructures 9th ed 1985 ASM International Materials Park, OH
7. S. Arai, H. Akatsuka, and N. Kaneko Sn-Ag solder bump formation for flip-chip bonding by electroplating J Electrochem Soc 150 2003 C730 764
8. S.Y. Jang, J. Wolf, O. Ehrmann, H. Gloor, H. Reichl, and K.W. Paik Pb-free Sn/3.5 Ag electroplating bumping process and under bump metallization (UBM) IEEE Trans Electron Packag Manuf 25 2002 193 202
9. A. VanBeek, A. Stolk, and J.J. VanLoo Multiphase diffusion in the systems Fe-Sn and Ni-Sn Zeitschrift fur Metallkunde 73 1982 439 444
10. C.M. Chen, and S.W. Chen Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures Acta Mater 50 2002 2461 2469
11. C.E. Ho, S.C. Yang, and C.R. Kao Interfacial reaction issues for lead-free electronic solders J Mater Sci Mater El 18 2007 155 174
12. A.D. Smigelskas, and E.O. Kirkendall Zinc diffusion in alpha brass Trans Met Soc AIME 171 1947 130 142