Failure model for silver electrochemical migration

IEEE Transactions on Device and Materials Reliability

Volumn 7, Issue 1, 2007, Pages 188-196

  Yang, Shuang ^a,b   Christou, Aristos ^a,b  

^a IEEE   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Dendrite; Electrochemical migration (ECM); Insulation resistance; Ion accumulation; Ion generation

Indexed keywords

ELECTROCHEMICAL MIGRATION (ECM); INSULATION RESISTANCE; ION ACCUMULATION; ION GENERATION;

ATMOSPHERIC HUMIDITY; DENDRITES (METALLOGRAPHY); ELECTRIC INSULATION; ELECTRIC RESISTANCE; ELECTROCHEMISTRY; FAILURE ANALYSIS; MATHEMATICAL MODELS;

SILVER;

EID: 34547149463     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2007.891531     Document Type: Conference Paper

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