Au-sn SLID bonding - Properties and possibilities

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 43, Issue 2, 2012, Pages 397-405

  Tollefsen, Torleif A ^a,b   Larsson, Andreas ^a,c   Løvvik, Ole Martin ^c,d   Aasmundtveit, Knut ^b  

^a SINTEF ICT   (Norway)

^b UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

^c SINTEF MATERIALS AND CHEMISTRY   (Norway)

^d UNIVERSITY OF OSLO   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING CONDITIONS; CRYSTAL PHASIS; HIGH TEMPERATURE; INTERCONNECT TECHNOLOGY; RELIABILITY TEST; SOLID-LIQUID; THERMOMECHANICAL PROPERTIES;

METALLURGICAL ENGINEERING;

TIN;

EID: 84861807498     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-011-9609-z     Document Type: Review

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