Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

Journal of Electronic Materials

Volumn 43, Issue 4, 2014, Pages 983-995

  Li, J F ^a   Agyakwa, P A ^a   Johnson, C M ^a  

^a UNIVERSITY OF NOTTINGHAM   (United Kingdom)

Author keywords

die attachment; diffusion; interfacial reaction; intermetallic compounds; solid solution; Transient liquid phase (TLP) bonding

Indexed keywords

BINARY ALLOYS; DIFFUSION; INTERMETALLICS; LIQUIDS; METALLIZING; RATE CONSTANTS; SILICON; SILVER; SOLID SOLUTIONS; SURFACE CHEMISTRY;

BASE METALS; DIE ATTACHMENT; DIFFUSION CONTROLLED GROWTH; EXTENDED BONDING; KINETIC CONSTANT; SI CHIPS; TRANSIENT LIQUID PHASE; TRANSIENT LIQUID PHASE BONDING;

TIN;

EID: 84899126094     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2971-7     Document Type: Article

References (33)

1. L. Bernstein, J. Electrochem. Soc. 113, 1282 (1966).
2. C.C. Lee and C.Y. Wang, Thin Solid Films 208, 202 (1992).
3. G.S. Matijasevic, C.C. Lee, and C.Y. Wang, Thin Solid Films 223, 276 (1993).
4. G. Humpston and D.M. Jacobson, Principles of Soldering (Materials Park: ASM International, 2004), pp. 230-235.
5. J.F. Li, P.A. Agyakwa, and C.M. Johnson, Acta Mater. 58, 3429 (2010).
6. J.F. Li, P.A. Agyakwa, and C.M. Johnson, Acta Mater. 59, 1198 (2011).
7. D.E. Crees, G. Humpston, D.M. Jacobson, and D. Newcombe, GEC J. Res. 6, 71 (1988).
8. T.B. Wang, Z.Z. Shen, R.Q. Ye, X.M. Xie, F. Stubhan, and J. Freytag, J. Electron. Mater. 29, 443 (2000).
9. F. Bartels, J.W. Morris, G. Dalke, and W. Gust, J. Electron. Mater. 23, 787 (1994).
10. E. Lugscheider, K. Bobzin, and M.K. Lake, Surf. Coat. Technol. 142-144, 813 (2001).
11. N.S. Bosco and F.W. Zok, Acta Mater. 53, 2019 (2005).
12. E. Lugscheider, K. Bobzin, M. Maes, S. Ferrara, and A. Erdle, Surf. Coat. Technol. 200, 444 (2005).
13. S. Sommadossi, W. Gust, and E.J. Mittemeijer, Mater. Chem. Phys. 77, 924 (2002).
14. P.K. Khanna, G. Dalke, and W. Gust, Z. Metallkd. 90, 722 (1999).
15. N. Quitoriano, W.S. Wong, L. Tsakalakos, Y. Cho, and T. Sands, J. Electron. Mater. 30, 1471 (2001).
16. T. Studnitzky and R. Schmid-Fetzer, J. Electron. Mater. 32, 70 (2003).
17. K. Guth, N. Oeschler, L. Bower, R. Speckels, G. Strotman, N. Heuck, S. Krasel, A. Ciliox, in Proceedings of 7th International Conference on Integrated Power Electronics Systems, 6-8 March 2012, Nuremberg, Germany, pp. 380-384.
18. ''Binary Ag-Sn phase diagram,'' Facility for the Analysis of Chemical Thermodynamics (FACT). http://www.crct.polymtl.ca/FACT/phase-diagram.php?file=Ag - Sn.jpg&dir=SGTE.
19. H.F. Hsu and S.W. Chen, Acta Mater. 52, 2541 (2004).
20. G. Ghosh, J. Appl. Phys. 88, 6887 (2000).
21. G. Ghosh, Acta Mater. 49, 2609 (2001).
22. V. Tikare and J.D. Cawley, Acta Mater. 46, 1333 (1998).
23. Z. Mei, A.J. Sunwoo, and J.W. Morris Jr, Metall. Trans. A23, 857 (1992).
24. J.F. Li, P.A. Agyakwa, and C.M. Johnson, J. Mater. Sci. 45, 2340 (2010).
25. J.F. Li, P.A. Agyakwa, and C.M. Johnson, Intermetallics 40, 50 (2013).
26. H.W. King and T.B. Massalski, Philos. Mag. 6, 669 (1961).
27. W. Klement Jr, Trans Metall Soc AIME 233, 1182 (1965).
28. R.H. Kane, B.C. Giessen, and N.J. Grant, Acta Metall. 14, 605 (1966).
29. C.W. Fairhurst and J.B. Cohen, Acta Crystallogr. B28, 371 (1972).
30. S. Barat and J.K. Mukherjee, Indian J. Technol. 13, 510 (1975).
31. Y. Ning and X. Zhou, J. Alloys Compd. 182, 131 (1992).
32. E. Roennebro, J. Yin, A. Kitano, M. Wada, and T. Sakai, Solid State Ion. 176, 2749 (2005).
33. T. Okabe, R.F. Hochman, and M.E. Mclain, J. Biomed. Res. 8, 381 (1974).