Au-Sn SLID bonding: A reliable HT interconnect and die attach technology

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 44, Issue 2, 2013, Pages 406-413

  Tollefsen, Torleif André ^a,b   Larsson, Andreas ^a   Taklo, Maaike Margrete Visser ^a   Neels, Antonia ^c   Maeder, Xavier ^c   Høydalsvik, Kristin ^d   Breiby, Dag W ^d   Aasmundtveit, Knut ^b  

^a SINTEF ICT   (Norway)

^b UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

^c CSEM   (Switzerland)

^d NORWEGIAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; FRACTURE; GOLD METALLOGRAPHY; LIFE CYCLE; NICKEL COMPOUNDS; SILICON CARBIDE; SILICON COMPOUNDS; TIN ALLOYS;

DESIGN RULES; FRACTOGRAPHIC; FRACTURE MODE; HIGH QUALITY; HIGH TEMPERATURE; INTERCONNECT TECHNOLOGY; LAYERED STRUCTURES; SOLID-LIQUID;

TIN METALLOGRAPHY;

EID: 84878573998     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-012-9789-1     Document Type: Article

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