Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering

Intermetallics

Volumn 16, Issue 8, 2008, Pages 962-968

  Gollas, Bernhard ^a,b   Albering, Jörg H ^a   Schmut, Katharina ^a,b   Pointner, Volker ^a,b   Herber, Ralph ^c   Etzkorn, Johannes ^c  

^a GRAZ UNIVERSITY OF TECHNOLOGY   (Austria)

^b ECHEM Kompetenzzentrum fur Angewandte Elektrochemie GmbH   (Austria)

^c ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

A. Intermetallics, miscellaneous; B. Phase transformations; C. Electroplating; C. Joining; F. Diffraction

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CHEMICAL ANALYSIS; COPPER; COPPER PLATING; ELECTROCHEMISTRY; ELECTROPLATING; GRAPHIC METHODS; NICKEL; NICKEL ALLOYS; PHASE DIAGRAMS; PHASE TRANSITIONS; SEMICONDUCTOR DOPING; SILVER; SOLDERING; SOLID SOLUTIONS; TIN ALLOYS; TITANIUM COMPOUNDS; WELDING; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS;

ALLOY PHASE; COPPER SUBSTRATES; HEATING UP; IN SITU X RAY DIFFRACTION; IN-SITU XRD; ISOTHERMAL DIFFUSION; MONITOR (CO); PERITECTIC; PHASE EVOLUTIONS; PROCESS TEMPERATURES; REACTION ZONE (RZ); SOLDER LAYERS; THIN LAYERING;

TIN;

EID: 48349140390     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2008.04.014     Document Type: Article

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