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Volumn 108, Issue 6, 2010, Pages

The early stage dissolution of Ni and the nucleation of Ni-Sn intermetallic compound at the interface during the soldering of Sn-3.5Ag on a Ni substrate

(2) Lin, Yu Wei a Lin, Kwang Lung a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION ZONES; ELECTROPLATED NI; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPES; INTERFACIAL REGION; INTERMETALLIC COMPOUNDS; NI SUBSTRATES; SN-3.5AG; SOLDERING REACTIONS;

DIFFUSION; FLIP CHIP DEVICES; LIQUID NITROGEN; NUCLEATION; SEMICONDUCTING INTERMETALLICS; SOLDERING; TIN; TRANSMISSION ELECTRON MICROSCOPY;

DISSOLUTION;

EID: 77957741925 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3484493 Document Type: Article

Times cited : (18)

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