Tensile creep characteristics of Sn-3.5Ag-0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles

Materials Science and Engineering: A

Volumn 603, Issue , 2014, Pages 1-10

  Fawzy, A ^a   Fayek, S A ^b   Sobhy, M ^a   Nassr, E ^a   Mousa, M M ^a   Saad, G ^a  

^a Ain Shams University   (Egypt)

^b NATIONAL CENTER FOR RADIATION RESEARCH AND TECHNOLOGY   (Egypt)

Author keywords

Composite solder; Creep resistance; Nano metric; Structural refinement

Indexed keywords

BINARY ALLOYS; CREEP; GRAIN GROWTH; II-VI SEMICONDUCTORS; LEAD-FREE SOLDERS; NANOCOMPOSITES; PACKAGING MATERIALS; PARTICLE REINFORCED COMPOSITES; SILVER ALLOYS; SOLDERING; TERNARY ALLOYS; ZINC OXIDE;

COMPOSITE SOLDERS; CREEP CHARACTERISTICS; ELECTRONIC PACKAGING MATERIAL; MATERIAL INDUSTRIES; MECHANICAL RESPONSE; NANO COMPOSITE; NANO-METRIC; STRUCTURAL REFINEMENT; TENSILE CREEP; ZNO PARTICLES;

CREEP RESISTANCE;

EID: 84903362413     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2014.02.061     Document Type: Article

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