Novel SiC nanoparticles-containing Sn-1.0Ag-0.5Cu solder with good drop impact performance

Materials Science and Engineering: A

Volumn 578, Issue , 2013, Pages 62-71

  El Daly, A A ^a   Fawzy, A ^b   Mansour, S F ^a   Younis, M J ^c  

^a Zagazig University   (Egypt)

^b Ain Shams University   (Egypt)

^c ISLAMIC UNIVERSITY OF GAZA   (Palestine)

Author keywords

Lead free composite solders; Mechanical properties; Microstructure; Sn Ag Cu alloys

Indexed keywords

BALL MILLING; BINARY ALLOYS; COPPER ALLOYS; DROPS; ENERGY DISSIPATION; GRAIN REFINEMENT; LEAD-FREE SOLDERS; NANOPARTICLES; PARTICLE SIZE; SILICON CARBIDE; TENSILE STRENGTH; TERNARY ALLOYS; TIN ALLOYS;

COMPOSITE SOLDERS; DROP IMPACT; HIGH-ENERGY BALL MILLING; IMPACT PERFORMANCE; LEAD-FREE; LEAD-FREE COMPOSITE SOLDER; MECHANICAL MIXING; SIC NANOPARTICLES; WEAK INTERFACE; Β-SN;

SILVER ALLOYS;

EID: 84879169094     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2013.04.022     Document Type: Article

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