Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn-9Zn lead-free solders

Materials Science and Engineering: A

Volumn 527, Issue 20, 2010, Pages 5212-5219

  El Daly, A A ^a   Hammad, A E ^a  

^a Zagazig University   (Egypt)

Author keywords

Lead free solder; Mechanical properties; Microstructure; Sn Zn alloy

Indexed keywords

ALLOYING; BINARY ALLOYS; COPPER ALLOYS; DUCTILITY; EUTECTICS; LEAD-FREE SOLDERS; SILVER ALLOYS; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS; YIELD STRESS; ZINC ALLOYS;

INTERMETALLICS COMPOUNDS; MICROSTRUCTURE AND PROPERTIES; MICROSTRUCTURES AND MECHANICAL PROPERTIES; NEEDLE-LIKE; RICH PHASE; SN-9ZN SOLDER; SOLDER ALLOYS; STRENGTH AND DUCTILITIES; TENSILE DUCTILITY; ULTIMATE TENSILE STRENGTH;

MICROSTRUCTURE;

EID: 77953811796     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.04.078     Document Type: Article

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