Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu

Materials Science and Engineering: A

Volumn 530, Issue 1, 2011, Pages 402-410

  Esfandyarpour, M J ^a   Mahmudi, R ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Lead free solder; Sn Sb alloy; Stress exponent; Tensile properties

Indexed keywords

ACTIVATION ENERGY; ALLOYING ELEMENTS; BISMUTH ALLOYS; COPPER ALLOYS; DEFORMATION; DUCTILITY; GRAIN BOUNDARIES; INTERMETALLICS; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; SOLDERED JOINTS; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING; TERNARY ALLOYS; TIN ALLOYS;

DEFORMATION BEHAVIOR; DISLOCATION CLIMB; INTER-METALLIC PARTICLE; LEAD-FREE SOLDER ALLOY; STRAIN-RATES; STRESS EXPONENTS; STRUCTURAL REFINEMENT; TENSILE BEHAVIORS; TENSILE DEFORMATION; TESTING TEMPERATURE;

BINARY ALLOYS;

EID: 82255179259     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.09.103     Document Type: Article

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