메뉴 건너뛰기




Volumn 486, Issue 1-2, 2009, Pages 768-773

Creep properties of Ag-2 wt% Cu alloy in the solid solution region

Author keywords

Creep; Deformation temperature; Grain diameter; Stress exponent

Indexed keywords

APPLIED STRESS; CONTROLLING MECHANISM; CREEP PARAMETERS; CREEP PROCESS; CREEP PROPERTIES; CU ALLOY; DEFORMATION TEMPERATURE; DEFORMATION TEMPERATURES; DIFFERENT GRAIN DIAMETER; ENERGY DISPERSIVE X RAY SPECTROSCOPY; GLIDE OF DISLOCATIONS; GRAIN DIAMETER; MICROSTRUCTURE EXAMINATION; OPTICAL MICROSCOPES; POWER LAW; STEADY STATE; STEADY STATE CREEP RATE; STRESS DEPENDENCE; STRESS EXPONENT; STRESS EXPONENTS; TRANSIENT STAGE; VISCOUS GLIDE;

EID: 70350127186     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.07.050     Document Type: Article
Times cited : (2)

References (27)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.