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Volumn 486, Issue 1-2, 2009, Pages 768-773
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Creep properties of Ag-2 wt% Cu alloy in the solid solution region
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Author keywords
Creep; Deformation temperature; Grain diameter; Stress exponent
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Indexed keywords
APPLIED STRESS;
CONTROLLING MECHANISM;
CREEP PARAMETERS;
CREEP PROCESS;
CREEP PROPERTIES;
CU ALLOY;
DEFORMATION TEMPERATURE;
DEFORMATION TEMPERATURES;
DIFFERENT GRAIN DIAMETER;
ENERGY DISPERSIVE X RAY SPECTROSCOPY;
GLIDE OF DISLOCATIONS;
GRAIN DIAMETER;
MICROSTRUCTURE EXAMINATION;
OPTICAL MICROSCOPES;
POWER LAW;
STEADY STATE;
STEADY STATE CREEP RATE;
STRESS DEPENDENCE;
STRESS EXPONENT;
STRESS EXPONENTS;
TRANSIENT STAGE;
VISCOUS GLIDE;
SILVER;
SILVER ALLOYS;
X RAY SPECTROSCOPY;
CREEP;
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EID: 70350127186
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2009.07.050 Document Type: Article |
Times cited : (2)
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References (27)
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