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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 9, 2013, Pages 3210-3218

Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn-3.5 Ag-0.5 Cu (SAC355) solder alloy

(6) Fawzy, A a Fayek, S A b Sobhy, M a Nassr, E a Mousa, M M a Saad, G a

a Ain Shams University (Egypt)

b NATIONAL CENTER FOR RADIATION RESEARCH AND TECHNOLOGY (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE LEAD-FREE SOLDERS; DISPERSION STRENGTHENING; ELECTRONIC COMPONENT; LEAD-FREE SOLDER ALLOY; LIQUIDUS TEMPERATURE; METALLOGRAPHIC OBSERVATIONS; SOLIDIFICATION PROCESS; STRESS STRAIN CHARACTERISTICS;

ALLOYS; CERIUM ALLOYS; COPPER COMPOUNDS; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; ZINC ALLOYS; ZINC OXIDE;

TIN;

EID: 84882686198 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-013-1230-2 Document Type: Article

Times cited : (46)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.