Effect of Sb addition on the tensile deformation behavior of lead-free Sn-3.5Ag solder alloy

Materials and Design

Volumn 32, Issue 10, 2011, Pages 5027-5032

  Mahmudi, R ^a   Mahin Shirazi, S ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

FRACTURE SURFACES; LEAD-FREE; MATRIX; SN-3.5AG; SN-3.5AG ALLOY; SN-3.5AG SOLDERS; SOLID SOLUTION HARDENING; STRAIN RATE SENSITIVITY; STRAIN-RATE HARDENING; STRUCTURAL REFINEMENT; TENSILE DEFORMATION; TENSILE SPECIMENS; ULTIMATE TENSILE STRENGTH; UNIAXIAL TENSIONS;

ALLOYS; DEFORMATION; DUCTILITY; FRACTURE; HARDENING; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS;

TIN;

EID: 79960920843     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.05.052     Document Type: Article

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