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Volumn 50, Issue 17, 2002, Pages 4315-4324

Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi

Author keywords

Creep; Fracture

Indexed keywords

BISMUTH; COPPER; CREEP TESTING; FRACTURE; GRAIN BOUNDARIES; GROWTH (MATERIALS); HEAT TREATMENT; NUCLEATION; SEGREGATION (METALLOGRAPHY); SOLDERING ALLOYS; STRAIN; STRESS ANALYSIS; TERNARY SYSTEMS;

EID: 0037048571     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(02)00263-X     Document Type: Article
Times cited : (31)

References (23)
  • 1
    • 0010475238 scopus 로고    scopus 로고
    • European Union WEEE Directive, 3rd Draft, May 2000
    • European Union WEEE Directive, 3rd Draft, May 2000.
  • 2
    • 0010478203 scopus 로고    scopus 로고
    • Japanese Ministry of Health and Welfare Waste Regulation, June 1998
    • Japanese Ministry of Health and Welfare Waste Regulation, June 1998.
  • 12
    • 0010436920 scopus 로고
    • Taplin D.M.R. Waterloo, Canada: University of Waterloo Press
    • Hutchison J.W., Obrecht H. Taplin D.M.R., Fracture. 1977;101 University of Waterloo Press, Waterloo, Canada.
    • (1977) Fracture , pp. 101
    • Hutchison, J.W.1    Obrecht, H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.