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Volumn 50, Issue 17, 2002, Pages 4315-4324
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Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi
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Author keywords
Creep; Fracture
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Indexed keywords
BISMUTH;
COPPER;
CREEP TESTING;
FRACTURE;
GRAIN BOUNDARIES;
GROWTH (MATERIALS);
HEAT TREATMENT;
NUCLEATION;
SEGREGATION (METALLOGRAPHY);
SOLDERING ALLOYS;
STRAIN;
STRESS ANALYSIS;
TERNARY SYSTEMS;
TERNARY ALLOYS;
TIN ALLOYS;
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EID: 0037048571
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6454(02)00263-X Document Type: Article |
Times cited : (31)
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References (23)
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