Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging

Materials and Design

Volumn 39, Issue , 2012, Pages 475-483

  Chuang, T H ^a   Tsao, L C ^b   Chung, Chien Han ^b   Chang, S Y ^c  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

A. Non ferros metals and alloys; D. Brazing and soldering; F. Microstructure

Indexed keywords

AGING CONDITIONS; AGING TIME; COOLING RATES; COUPLING EFFECT; DISPERSION STRENGTHENING; F. MICROSTRUCTURE; METALS AND ALLOYS; NANO POWDERS; NEEDLE-LIKE; SN GRAINS; TIO; TRACE AMOUNTS; UNIFORM MICROSTRUCTURE; VICKERS MICROHARDNESS;

COOLING; METALLURGY; MICROHARDNESS; MICROSTRUCTURE; MORPHOLOGY; NANOCOMPOSITES; SILVER; SOLDERING; SOLDERING ALLOYS; TITANIUM DIOXIDE;

TIN;

EID: 84859384393     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2012.03.021     Document Type: Article

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