Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

International Journal of Minerals, Metallurgy and Materials

Volumn 16, Issue 6, 2009, Pages 677-684

  Tai, Feng ^a   Guo, Fu ^a   Xia, Zhi dong ^a   Lei, Yong ping ^a   Shi, Yao wu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

composite solder; intermetallic compounds; isothermal aging; lead free solder; microstructure

Indexed keywords

AG PARTICLES; COMPOSITE SOLDERS; EUTECTIC SOLDERS; IMC LAYER; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LEAD FREE SOLDERS; NANO-SIZED; SN-0.7CU SOLDER; SOLDER JOINTS;

LEAD; LEAD COMPOUNDS; MICROSTRUCTURE; PARTICLE REINFORCED COMPOSITES; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS;

TIN;

EID: 73049084752     PISSN: 16744799     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1674-4799(10)60012-X     Document Type: Article

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