Effect of Ag addition on the creep characteristics of Sn-8.8 wt%Zn solder alloy

Journal of Alloys and Compounds

Volumn 479, Issue 1-2, 2009, Pages 844-850

  Saad, G ^a   Fawzy, A ^a   Shawky, E ^a  

^a Ain Shams University   (Egypt)

Author keywords

Metals and alloys; Microstructure; Precipitation; X ray diffraction

Indexed keywords

AG ADDITIONS; APPLIED STRESS; CREEP CHARACTERISTICS; CREEP PARAMETERS; CREEP TESTS; DEFORMATION TEMPERATURES; ENERGY DISPERSIVE X-RAY SPECTROSCOPIES; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; MECHANICAL BEHAVIORS; METALS AND ALLOYS; MICRO-STRUCTURAL CHANGES; MOVING DISLOCATIONS; PRECIPITATION; SCANNING ELECTRON MICROSCOPES; SOLDER ALLOYS; STEADY-STATE CREEP RATES; STRESS EXPONENTS;

BINARY ALLOYS; BRAZING; CERIUM ALLOYS; CREEP; DIFFRACTION; LEAD; METALLURGY; MICROSTRUCTURE; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; TIN ALLOYS; WELDING; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; ZINC;

CREEP RESISTANCE;

EID: 67349187275     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.01.069     Document Type: Article

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