Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders

Materials and Design

Volumn 51, Issue , 2013, Pages 789-796

  El Daly, A A ^a   El Taher, A M ^a  

^a Zagazig University   (Egypt)

Author keywords

Lead free solder; Mechanical properties; Microstructure

Indexed keywords

ALLOYS; CREEP; MECHANICAL PROPERTIES; MICROSTRUCTURE; NICKEL; PRECIPITATION (CHEMICAL); SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; UNDERCOOLING; ZINC;

DISLOCATION PILEUP; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; PRECIPITATE COARSENING; STRENGTHENING EFFECT; SUPERIOR CREEP RESISTANCE; THERMAL BEHAVIORS; UNDERCOOLING TEMPERATURE;

TIN;

EID: 84878371788     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.04.081     Document Type: Article

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