Transient and steady-state creep characteristics of Cu-2 wt% Sn alloy in the solid solution region

Physica B: Condensed Matter

Volumn 344, Issue 1-4, 2004, Pages 443-450

  Al Ganainy, G S ^a   Fawzy, A ^a   Abd El Salam, F ^a  

^a Ain Shams University   (Egypt)

Author keywords

Creep; Cu Sn alloys; Solid solution

Indexed keywords

ACTIVATION ENERGY; CREEP; DEFORMATION; DIFFUSION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HEAT CONDUCTION; ISOTHERMS; MICROSTRUCTURE; SINGLE CRYSTALS; SOLID SOLUTIONS; STACKING FAULTS; STRAIN RATE; STRESSES; TENSILE STRENGTH;

TRANSIENT CREEP PARAMETERS;

BRONZE;

EID: 0742285658     PISSN: 09214526     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physb.2003.10.028     Document Type: Article

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