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Microelectronics Reliability

Volumn 53, Issue 5, 2013, Pages 733-740

Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints

(2) Xie, H X a Chawla, N a

a Arizona State University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC PERFORMANCE; FAILURE MECHANISM; MECHANICAL SHOCK; SHOCK PERFORMANCE; SN-AG-CU LEAD-FREE SOLDERS; SNAGCU SOLDER; SOLDER JOINTS; TRACE AMOUNTS;

FRACTOGRAPHY; FRACTURE MECHANICS; INTERMETALLICS; LEAD; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN;

TIN;

EID: 84876406893 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/j.microrel.2012.12.010 Document Type: Article

Times cited : (24)

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