Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 129-134

  Schubert, A ^a   Walter, H ^a   Dudek, R ^a   Michel, B ^a   Lefranc, G ^a   Otto, J ^a   Mitic, G ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; DYNAMIC MECHANICAL ANALYSIS; ELASTIC MODULI; HEAT RESISTANCE; LEAD ALLOYS; STRAIN RATE; STRESS ANALYSIS; TENSILE TESTING; THERMAL EFFECTS; THERMAL EXPANSION;

THERMAL FATIGUE RESISTANCE;

SOLDERING ALLOYS;

EID: 0034999140     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)