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Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 1, 2012, Pages 156-163

Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

(3) Shen, Jun a Wu, Cuiping a Li, Shizeng a

a CHONGQING UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TESTS; CU ATOMS; IMC LAYER; MELTING PROPERTIES; MICROSTRUCTURAL OBSERVATIONS; REFINED MICROSTRUCTURE; SOLDER ALLOYS; SOLDER JOINTS; SURFACE ADSORPTION; TRACE AMOUNTS;

ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; MELTING; MICROHARDNESS; MICROSTRUCTURAL EVOLUTION; RARE EARTH ADDITIONS; REFINING; SOLDERING ALLOYS; TESTING; TIN ALLOYS;

TIN;

EID: 84856976367 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-011-0566-8 Document Type: Article

Times cited : (29)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.