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Volumn 517, Issue 14, 2009, Pages 4255-4259
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Impact reliability estimation of lead free solder joint with IMC layer
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Author keywords
Drop simulation; Failure behavior; Intermetallic compound; Nano indentation; Solder ball
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Indexed keywords
3-DIMENSIONAL;
BOARD LEVEL DROP TESTS;
BRITTLE FAILURES;
CHIP-SCALE PACKAGING;
CRITICAL ISSUES;
DROP IMPACTS;
FAILURE BEHAVIOR;
FINITE-ELEMENT ANALYSIS;
GEOMETRIC IRREGULARITIES;
IMC LAYERS;
INTERMETALLIC COMPOUND;
JEDEC STANDARDS;
KEY MATERIALS;
LEAD-FREE SOLDER JOINTS;
LEAD-FREE SOLDERS;
MATERIAL PROPERTIES;
NANO-INDENTATION TESTS;
NICKEL LAYERS;
NUMERICAL SIMULATIONS;
RELIABILITY ESTIMATIONS;
SOLDER BALL;
SOLDER BUMPING;
SOLDER JOINTS;
SOLDER RELIABILITIES;
STRAIN SOFTENING;
SURFACE FINISHING;
TEST DATUM;
BRAZING;
CHIP SCALE PACKAGES;
DROPS;
FAILURE ANALYSIS;
LEAD;
NANOINDENTATION;
SEMICONDUCTING INTERMETALLICS;
WELDING;
SOLDERING ALLOYS;
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EID: 65449180610
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2009.02.039 Document Type: Article |
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Times cited : (22)
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References (9)
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