Ductile-to-brittle transition induced by increasing strain rate in Sn-3Cu/Cu joints

Journal of Materials Research

Volumn 23, Issue 6, 2008, Pages 1614-1617

  Zou, H F ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; TENSILE STRAIN; TIN; TIN ALLOYS;

DUCTILE TO BRITTLE TRANSITION (DBT); EFFECTS OF STRAIN; STRENGTH (IGC: D5/D6);

STRAIN RATE;

EID: 48949117380     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0214     Document Type: Article

References (18)

1. M. Abtew and G. Selvaduray: Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95 (2000).
2. K. Zeng and K.N. Tu: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002).
3. S.C. Yang, C.E. Ho, C.W. Chang, and C.R. Kao: Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element. J. Appl. Phys. 101, 084911 (2007).
4. 0.7(Ni) lead-free solder alloy. Microelectron. Eng. 84, 144 (2007).
5. F. Lang, H. Tanaka, O. Munegata, T. Taguchi, and T. Narita: The effect of strain rate and temperature on the tensile properties of Sn-3.5Ag solder. Mater. Charact. 54, 223 (2005).
6. I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki: Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity. Mater. Sci. Eng., A 366, 50 (2004).
7. B.Y. Wu, H.W. Zhong, Y.C. Chan, and M.O. Alam: Shearing tests of solder joints on tape ball grid array substrates. J. Mater. Res. 21(9), 2224 (2006).
8. F. Ren, J.W. Nah, K.N. Tu, B. Xiong, L. Xu, and J.H.L. Pang: Electromigration induced ductile-to-brittle transition in lead-free solder joints. Appl. Phys. Lett. 89, 141914 (2006).
9. H.T. Lee and M.H. Chen: Influence of intermetallic compounds on the adhesive strength of solder joints. Mater. Sci. Eng., A 333, 24 (2002).
10. H.T. Lee, M.H. Chen, H.M. Jao, and T.L. Liao: Influence of interfacial intermetallic compound on fracture behavior of solder joints. Mater. Sci. Eng., A 358, 134 (2003).
11. J.W. Yoon, S.W. Kim, and S.B. Jung: Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging. J. Alloys Compd. 391, 82 (2005).
12. K.S. Bae and S.J. Kim: Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints. J. Mater. Res. 17(4), 743 (2002).
13. L. Pang, S.M. Han, and K.S. Kumar: Tensile response of an Fe-40Al-0.7C-0.5B alloy. Acta Mater. 50, 3623 (2002).
14. L. Pang and K.S. Kumar: Mechanical behavior of an Fe-40Al-0.6C alloy. Acta Mater. 46(11), 4017 (1998).
15. D.G. Kim, J.W. Kim, and S.B. Jung: Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM. Mater. Sci. Eng., B 121, 204 (2005).
16. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu: Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test. Scripta Mater. 51, 641 (2004).
17. K. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, and K.N. Tu: Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005).
18. X. Deng, N. Chawla, K.K. Chawla, and M. Koopman: Deformation behavior of (Cu,Ag)-Sn intermetallics by nanoindentation. Acta Mater. 52, 4291 (2004).