Numerical study of ductile failure morphology in solder joints under fast loading conditions

Microelectronics Reliability

Volumn 50, Issue 12, 2010, Pages 2059-2070

  Shen, Y L ^a   Aluru, K ^a  

^a MSC01 1070   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED STRAIN; COPPER SUBSTRATES; CRACK PATHS; DAMAGE EVOLUTION; DEFORMATION MODES; DUCTILE DAMAGE MODELS; DUCTILE FAILURES; ELASTIC VISCOPLASTIC; FAILURE PATTERNS; FAST LOADING; FINITE ELEMENT MODELS; HIGH STRAIN RATES; IMPACT LOADINGS; LAP-SHEAR TESTING; LOADING MODES; NUMERICAL STUDIES; RATE INCREASE; SHEAR LOADINGS; SOLDER ALLOYS; SOLDER JOINTS; THROUGH CRACKS;

CRACKS; DEFORMATION; DUCTILITY; FINITE ELEMENT METHOD; LOADING; SILVER ALLOYS; TIN;

STRAIN RATE;

EID: 78649444539     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.06.001     Document Type: Article

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