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Journal of Electronic Materials

Volumn 41, Issue 2, 2012, Pages 412-424

Fracture of Sn-Ag-Cu solder joints on Cu substrates. II: Fracture mechanism map

(6) Kumar, P a Huang, Z a Dutta, I a Sidhu, R b Renavikar, M b Mahajan, R b

a Washington State University (United States)

b INTEL CORPORATION (United States)

Author keywords

Fracture mechanism map; interfacial fracture; Sn Ag solders; solder joint fracture

Indexed keywords

CLEAVAGE FRACTURE; COHESIVE FRACTURE; CU SUBSTRATE; FRACTURE MECHANISMS; FRACTURE TOUGHNESS VALUES; INTERFACIAL FRACTURE; INTERFACIAL INTERMETALLICS; JOINT FRACTURE; JOINT MICROSTRUCTURES; LOADING ANGLE; LOADING CONDITION; MICROSTRUCTURE DESIGN; RAPID ASSESSMENT; SN-AG SOLDER; SNAGCU SOLDER; SOLDER JOINTS; STRAIN-RATE-DEPENDENT;

BRITTLE FRACTURE; CHIP SCALE PACKAGES; INTERMETALLICS; LEAD; LOADING; MICROSTRUCTURE; PACKAGING MATERIALS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; TIN; YIELD STRESS;

FRACTURE TOUGHNESS;

EID: 84855428809 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1806-7 Document Type: Article

Times cited : (24)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.