On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

Scripta Materialia

Volumn 66, Issue 8, 2012, Pages 586-589

  Yazzie, K E ^a   Xie, H X ^a   Williams, J J ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

Cu 6Sn 5; Ductile fracture; Intermetallic compound; Mechanical shock; Pb free solder

Indexed keywords

BULK SOLDER; HIGH STRAIN RATES; INTERMETALLIC COMPOUND; INTERMETALLIC LAYER; LOW STRAIN RATES; MECHANICAL BEHAVIOR; MECHANICAL SHOCK; PB FREE SOLDERS; SN-BASED SOLDERS; SOLDER JOINTS; SOLDER-JOINT STRENGTH; STRAIN-RATE-DEPENDENT;

DUCTILE FRACTURE; INTERMETALLICS; LEAD; SOLDERING ALLOYS; STRAIN RATE;

TIN;

EID: 84862777806     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2012.01.009     Document Type: Article

References (15)

1. K.C. Ong, V.B. Tan, C.T. Lim, E.H. Wong, X.W. Zhang, in: Proceedings of the 54th IEEE Electronic Components and Technology Conference, 2004, vol. 1, pp. 1075-1079.
2. C.R. Siviour, D.M. Williamson, S.J.P. Palmer, S.M. Walley, W.G. Proud, and J.E. Field Journal De Physique IV (Proc) 110 2003 6
3. D. Reiff, E. Bradley, in: Proceedings of the 55th IEEE Electronic Components and Technology Conference 2005, vol. 2, pp. 1519-1525.
4. Z.J. Xu, T.X. Yu, in: EPTC 2008, 10th IEEE Electronics Packaging Technology Conference, 2008, pp. 1080-1085.
5. J.-M. Kim, S.-W. Woo, Y.-S. Chang, Y.-J. Kim, J.-B. Choi, and K.-Y. Ji Thin Solid Films 517 2009 4255 4259
6. N. Chawla International Materials Reviews 54 2009 368 384
7. P. Geng, P. Chen, Yun Ling, in: Proceedings of the 52nd IEEE Electronic Components and Technology Conference, 2002, pp. 974-978.
8. D. Suh, D.W. Kim, P. Liu, H. Kim, J.A. Weninger, C.M. Kumar, A. Prasad, B.W. Grimsley, and H.B. Tejada Materials Science Engineering: A 460-461 2007 595 603
9. T.T. Mattila, and J.K. Kivilahti Journal of Electronic Materials 34 2005 969 976
10. X. Deng, M. Koopman, N. Chawla, and K. Chawla Materials Science Engineering: A 364 2004 240 243
11. L. Jiang, and N. Chawla Scripta Materialia 63 2010 480 483
12. H. Fei, K. Yazzie, J. Williams, N. Chawla, and H. Jiang Journal of Computational and Theoretical Nanoscience 8 2011 873 880
13. H. Fei, K.E. Yazzie, N. Chawla, H. Jiang, Journal of Electronic Materials (2011) in press.
14. R. Darveaux, C. Reichman, N. Islam, in: Electronic Components and Technology Conference, IEEE, 2006, pp. 906-917.
15. K.E. Yazzie, N. Chawla, 2012, unpublished work.