Lead-free solders with rare earth additions

JOM

Volumn 61, Issue 6, 2009, Pages 39-44

  Guo, Fu ^a   Zhao, Mengke ^a   Xia, Zhidong ^a   Lei, Yongping ^a   Li, Xiaoyan ^a   Shi, Yaowu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY DEVELOPMENT; COMPREHENSIVE PROPERTIES; CURRENT STATUS; FABRICATION TECHNIQUE; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MECHANICAL STRENGTH; MICROSTRUCTURAL STABILITY; RE ELEMENTS; RESEARCH EFFORTS; SN-AG-CU; WETTING BEHAVIOR;

ALLOYING; ALLOYING ELEMENTS; COPPER ALLOYS; LEAD; MECHANICAL PROPERTIES; RARE EARTH ADDITIONS; RARE EARTH ELEMENTS; RARE EARTHS; RESEARCH; SILVER; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 70349737890     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-009-0086-7     Document Type: Review

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