Solder joint reliability and characteristics of deformation and crack growth of Sn-Ag-Cu versus eutectic Sn-Pb on a WLP in a thermal cycling test

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 2, 2002, Pages 84-90

  Kim, Deok Hoon ^a   Elenius, Peter ^a   Barrett, Scott ^a  

^a Flip Chip Technologies   (United States)

Author keywords

Solder joint reliability; Thermal cycling test; Wafer level package

Indexed keywords

CRACK PROPAGATION; EUTECTICS; FATIGUE OF MATERIALS; HIGH TEMPERATURE EFFECTS; RELIABILITY; SHEAR DEFORMATION; SOLDERING ALLOYS; THERMAL CYCLING;

WAFER LEVEL PACKAGE (WLP);

SOLDERED JOINTS;

EID: 0036545124     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.1021592     Document Type: Article

References (6)

1. The Ultra CSP wafer level package
2. Reliability characterization in Ultra CSP package development
3. Lead free solder for flip chips
4. Deformation and crack growth characteristics of SnAgCu versus 63SnPb solder joints on a WLP in thermal cycle testing
5. Constitutive behavior of lead-free solders versus lead-containing solders - Experiments on hulk specimens and flip chip joints