Rate-dependent behavior of Sn alloy-Cu couples: Effects of microstructure and composition on mechanical shock resistance

Acta Materialia

Volumn 60, Issue 10, 2012, Pages 4336-4348

  Yazzie, K E ^a   Fei, H E ^a   Jiang, H ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

Cu 6Sn 5; Fracture; Mechanical shock; Pb free solder; Strain rate

Indexed keywords

BULK SOLDER; DYNAMIC STRENGTH; ELECTRONIC PACKAGING; FRACTURE BEHAVIOR; FRACTURE MECHANISMS; HIGH STRAIN RATES; IMC LAYER; INTERMETALLIC COMPOUND LAYER; LAYER THICKNESS; LOW STRAIN RATES; MECHANICAL SHOCK; ON DYNAMICS; PB FREE SOLDERS; SOLDER JOINTS; SOLDER MICROSTRUCTURE; SOLDER-JOINT STRENGTH; THREE DIMENSIONS;

COPPER ALLOYS; DYNAMICS; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; LEAD COMPOUNDS; MECHANISMS; SOLDERING ALLOYS; STRAIN RATE; TIN;

FRACTURE;

EID: 84861122461     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.04.018     Document Type: Article

References (43)

1. N. Chawla Int Mater Rev 54 2009 368
2. J. Glazer JEM 23 1994 693
3. J. Glazer Int Mater Rev 40 1995 65
4. M. McCormack, and S. Jin JOM 45 1993 36
5. P.T. Vianco, and D.R. Frear JOM 45 1993 14
6. W.J. Plumbridge J Mater Sci 31 1996 2501
7. T.Y. Tee, H.S. Ng, C.T. Lim, E. Pek, and Z. Zhong Microelectron Reliab 44 2004 1131
8. D. Reiff, and E. Bradley IEEE Elec Comp C Proc 55 2005 1519
9. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu IEEE Elec Comp C Proc 54 2004 668
10. K.T. Tsai, F.L. Liu, E.H. Wong, and R. Rajoo Solder Surf Mt Tech 18 2006 12
11. P. Pandher, and M. Boureghda Int Rel Phys Proc 45 2007 107
12. K. Newman IEEE Elec Comp C Proc 55 2005 1194
13. J.Y. Chia, B. Cotterell, and T.C. Chai Mat Sci Eng A 417 2006 259
14. F. Ochoa, J.J. Williams, and N. Chawla JOM 55 2003 56
15. F. Ochoa, X. Deng, and N. Chawla JEM 33 2004 1596
16. R. Darveaux, and C. Reichman IEEE El Packag Tech Conf Proc 8 2006 283
17. H. Fei, K. Yazzie, J. Williams, N. Chawla, and H. Jiang J Comput Theor Nanos 8 2011 873
18. E.H. Wong, R. Rajoo, Y.W. Mai, S.K. Sean, K.T. Tsai, and L.M. Yap IEEE Elec Comp C Proc 55 2005 1202
19. K.E. Yazzie, J.J. Williams, D. Kingsbury, P. Peralta, H. Jiang, and N. Chawla JOM 62 2010 16
20. T.T. Mattila, and J.K. Kivilahti JEM 34 2005 969
21. X. Deng, M. Koopman, N. Chawla, and K. Chawla Mat Sci Eng A 364 2004 240
22. L. Jiang, and N. Chawla Scripta Mater 63 2010 480
23. K. Yazzie, H. Xie, J. Williams, and N. Chawla Scripta Mater 66 2012 586
24. P. Geng, P. Chen, and Yun Ling IEEE Elec Comp C Proc 52 2002 974
25. D. Suh, D.W. Kim, P. Liu, H. Kim, J.A. Weninger, and C.M. Kumar Mat Sci Eng A 460-461 2007 595
26. X. Deng, R. Sidhu, P. Johnson, and N. Chawla Metall Mater Trans A 36 2005 55
27. H. Fei, K.E. Yazzie, N. Chawla, and H. Jiang J Comput Theor Nanos 8 2011 873
28. Fei H, Yazzie, KE, Chawla, N, Jiang, H. JEM, in press.
29. Yazzie K, Topliff J, Chawla N. Metall Mater Trans 2012, submitted for publication.
30. N. Chawla, Y.L. Shen, X. Deng, and E.S. Ege JEM 33 2004 1589
31. X. Deng, N. Chawla, K.K. Chawla, and M. Koopman Acta Mater 52 2004 4291
32. F. Stepniak Microelectron Reliab 44 2004 805
33. E.H. Wong, R. Rajoo, Y.W. Mai, S.K.W. Seah, K.T. Tsai, and L.M. Yap IEEE Elec Comp C Proc 55 2005 1202
34. J.J.M. Zaal, H.P. Hochstenbach, W.D. van Driel, and G.Q. Zhang Microelectron Reliab 49 2009 846
35. A. Lal, and E. Bradley IEEE Elec Comp C Proc 56 2006 1628
36. R. Darveaux, and C. Reichman IEEE Elec Comp C Proc 56 2006 283
37. Y.A. Su, L.B. Tan, T.Y. Tee, and V.B.C. Tan Microelectron Reliab 50 2010 564
38. H.F. Zou, and Z.F. Zhang J Mater Res 23 2008 1614
39. H.F. Zou, and Z.F. Zhang Microelectron Eng 87 2010 601
40. Z. Huang, P. Kumar, I. Dutta, J.H.L. Pang, R. Sidhu, and M. Renavikar JEM 41 2012 375
41. P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar, and R. Mahajan JEM 41 2012 412
42. H.T. Lee, M.H. Chen, H.M. Jao, and T.L. Liao Mater Eng A 358 2003 134
43. S.M. Hayes, N. Chawla, and D.R. Frear Microelectron Reliab 49 2009 269