Electromagnetic-simulation program with integrated circuit emphasis modeling, analysis, and design of 3-D power delivery

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 4, 2013, Pages 641-652

  Xu, Zheng ^a,b   Wu, Qi ^a,c   He, Huanyu ^a   Lu, James Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b IBM   (United States)

^c Skyera Inc   (United States)

Author keywords

3 D integration; decoupling capacitor; electromagnetic; modeling; packaging; power delivery; solder; through silicon vias (TSVs)

Indexed keywords

3-D INTEGRATION; DECOUPLING CAPACITOR; ELECTROMAGNETIC; POWER DELIVERY; THROUGH SILICON VIAS;

ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER DISTRIBUTION; ELECTRIC POWER TRANSMISSION; ELECTROMAGNETISM; MODELS; PACKAGING; SOLDERING ALLOYS; SPICE; THREE DIMENSIONAL COMPUTER GRAPHICS;

THREE DIMENSIONAL;

EID: 84875901331     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2235915     Document Type: Article

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