Electromagnetic-SPICE modeling and analysis of 3D power network

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 2171-2178

  Xu, Zheng ^a   Lu, Jian Qiang ^a   Webb, Bucknell C ^b   Knickerbocker, John U ^b  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D SYSTEMS; ACCURATE MODELING; DE-COUPLING CAPACITANCE; DESIGN IMPLICATIONS; ELECTRICAL PERFORMANCE; FLOOR-PLANNING; MODELING AND ANALYSIS; ON-CHIP POWER GRIDS; OPERATING FREQUENCY; PACKAGING DESIGNS; PASSIVE ELEMENTS; POINTS OF INTEREST; POWER DELIVERY; POWER NETWORKS; POWER PERFORMANCE; SPICE MODEL;

CAPACITANCE; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER TRANSMISSION; ELECTROMAGNETISM; SPICE;

THREE DIMENSIONAL;

EID: 79960413400     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898820     Document Type: Conference Paper

References (7)

1. International Technology Roadmap for Semiconductors (ITRS), 2010 update.
2. J. U. Knickerbocker et al., "Three-Dimentional Silicon integration", IBM Journal of Research and Development, Vol. 52, No. 6, Nov. 2008, pp. 537-664.
3. J.-Q. Lu, "3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems", in Proc. IEEE, vol. 97, no. 1, Jan. 2009, pp. 18-30.
4. J.-Q. Lu et al., "3D architecture for power delivery to microprocessors and ASICs", in Proc. 3rd International Conference of 3D Archetecture for Semiconductor Integration and Packaging, 2006.
5. T. Zhang et al., "3-D Data Storage, Power Delivery, and RF/Optical Transceiver-Case Studies of 3-D Integration From System Design Perspectives", in Proc. IEEE, vol. 97, no. 1, Jan. 2009, pp. 161-174.
6. Manual of Ansoft Q3D v9 2010.
7. Intel Xeon processor.