3-D data storage, power delivery, and RF/optical transceiver-case studies of 3-D integration from system design perspectives

Proceedings of the IEEE

Volumn 97, Issue 1, 2009, Pages 161-174

  Zhang, Tong ^a   Micheloni, Rino ^b   Zhang, Guoyan ^a   Huang, Zhaoran Rena ^a   Lu, James Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

Author keywords

3 D integration; Flash memory; Hybrid communication; Integrated circuits; On chip power delivery

Indexed keywords

COST REDUCTION; DISTRIBUTED DATABASE SYSTEMS; ELECTRIC POWER TRANSMISSION; FLASH MEMORY; INTEGRATED CIRCUITS; RADIO TRANSCEIVERS; SENSOR NETWORKS; SYSTEMS ANALYSIS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

3-D INTEGRATION; DISTRIBUTED SENSOR NETWORKS; FUNCTIONAL COMPONENTS; HETEROGENEOUS INTEGRATION; MULTIPLE MATERIALS; ON CHIPS; REPRESENTATIVE CASE; THREE DIMENSIONAL (3D) INTEGRATION;

DATA INTEGRATION;

EID: 61549115557     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2008.2007478     Document Type: Article

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