A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment

Microelectronic Engineering

Volumn 92, Issue , 2012, Pages 15-18

  Chen, Qianwen ^a,b   Zhang, Dingyou ^a   Xu, Zheng ^a   Beece, Adam ^a   Patti, Robert ^c   Tan, Zhimin ^b   Wang, Zheyao ^b   Liu, Litian ^b   Lu, Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b TSINGHUA UNIVERSITY   (China)

^c Tezzaron Semiconductor Corporation   (United States)

Author keywords

BCB template; Chip to wafer (C2 W); Cu Cu bonding; Precise alignment; Three dimensional (3D) integration

Indexed keywords

3-D INTEGRATION; 3D SYSTEMS; ALIGNMENT ACCURACY; BCB TEMPLATE; BENZOCYCLOBUTENE; BOND INTERFACE; BONDING INTERFACES; BONDING PROCESS; CHIP-TO-WAFER (C2 W); EDGE DEFINITION; HIGH THROUGHPUT; LOW COSTS; TEMPLATE FABRICATION; THREE-DIMENSIONAL (3D) INTEGRATION; WAFER LEVEL;

ALIGNMENT; BUTENES; FABRICATION; GRAIN GROWTH; INTEGRATION; THREE DIMENSIONAL;

WAFER BONDING;

EID: 84863251233     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.04.047     Document Type: Conference Paper

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