Processing material evaluation and ultra-wideband modeling of through-strata-via (TSV) in 3D integrated circuits and systems

ICSICT-2010 - 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology, Proceedings

Volumn , Issue , 2010, Pages 1802-1804

  Xu, Zheng ^a   Beece, Adam ^a   Zhang, Dingyou ^a   Chen, Qianwen ^a,b   Rose, Kenneth ^a   Lu, James Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

3D integration; Processing material; Through strata via; TSV; Wideband modeling

Indexed keywords

100 GHZ; 3-D INTEGRATED CIRCUIT; 3-D INTEGRATION; BROADBAND MODELING; ELECTRICAL CHARACTERIZATION; ELECTRICAL PERFORMANCE; FREQUENCY DOMAINS; FUNCTION BLOCK; HETEROGENEOUS INTEGRATION; HIGH BANDWIDTH; MATERIAL EVALUATION; POWER CONSUMPTION; THROUGH-STRATA-VIA; TIME DOMAIN; TSV; VOLUME PRODUCTION; WIDEBAND MODELING;

FREQUENCY DOMAIN ANALYSIS; INTEGRATED CIRCUITS; TIME DOMAIN ANALYSIS;

THREE DIMENSIONAL;

EID: 78751554802     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2010.5667669     Document Type: Conference Paper

References (2)

1. J.-Q. Lu, Proc. of the IEEE, 97(1), pp.18-30 (2009).
2. Z. Xu, A. Beece, K. Rose and J.-Q. Lu, IEEE Intern'l 3D System Integration Conference (3D IC), (2009).