Modeling and evaluation for electrical characteristics of through-strata-vias (TSVs) in three-dimensional integration

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Xu, Zheng ^a   Beece, Adam ^a   Rose, Kenneth ^a   Zhang, Tong ^a   Lu, Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGILENT; ELECTRICAL CHARACTERISTIC; ELECTRICAL PERFORMANCE; EQUIVALENT CIRCUIT MODEL; ESSENTIAL COMPONENT; FREQUENCY DOMAINS; MODELING RESULTS; PASSIVE ELEMENTS; THREE DIMENSIONAL INTEGRATION; THREE-DIMENSIONAL (3D); TIME DOMAIN; WAVE SCATTERING PARAMETERS;

SCATTERING PARAMETERS; SIMULATORS;

THREE DIMENSIONAL;

EID: 70549095281     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306543     Document Type: Conference Paper

References (9)

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